Chiplet is a solution of greater interest to a number of leading IC manufacturers such as AMD, Intel and TSMC. According to statistics, in 2024, the global market size of processor chips using Chiplet will reach US$5.8 billion, and by 2035 will reach US$57 billion, with a compound growth rate of about 23.09%.
The rapid growth of the Chiplet processor chip market size will drive up the demand for ABF Substrate. Advanced packaging technology is pushing up the consumption of ABF Substrate capacity, and high-end technology of 2.5/3D IC will have the opportunity for mass production in the future, which is bound to bring greater growth momentum.
